【ZiDongHua 之電子設計自動化收錄關鍵詞：芯華章 EDA 汽車芯片 國際集成電路產(chǎn)業(yè)論壇 汽車電子 智能汽車 汽車產(chǎn)業(yè) 】
 
 
　　芯華章攜仿真車驗證方案出席國際集成電路產(chǎn)業(yè)汽車芯片分論壇
 
 
　　近期，2023中國·南沙國際集成電路產(chǎn)業(yè)論壇在廣州盛大召開。作為國內領先的系統(tǒng)級驗證EDA解決方案提供商，芯華章科技應邀出席“汽車芯片分論壇”，共同探討汽車芯片產(chǎn)業(yè)的新機遇。芯華章科技汽車電子事業(yè)部首席算法科學家張磊博士受邀發(fā)表《場景+芯片仿真賦能個性化汽車芯片》的主題演講，分享基于場景的系統(tǒng)級仿真對于主機廠構建自主可控“芯”生態(tài)的廣闊應用場景。
 
　　Recently, the 2023 China·Nansha International Integrated Circuit Industry Forum was grandly held in Guangzhou. As a leading provider of system-level verification EDA solutions in China, X-EPIC was invited to attend the "Automotive Chip Sub-Forum" to discuss new opportunities in the automotive chip industry. Dr. Zhang Lei, Chief Algorithm Scientist of X-EPIC Automotive Electronics Division, was invited to deliver a keynote speech on "Scene + Chip Simulation Empowering Personalized Automotive Chips", sharing the importance of scenario- d system-level simulation for OEMs to build an independent and controllable "core" ecology broad applications.
 
　　
 
　　張磊博士簡介
 
　　About Dr. Zhang Lei
 
　　中科院計算所工學博士學位
 
　　武漢大學數(shù)學系本科
 
　　前SAS中國區(qū)首席科學家
 
　　TeraData&IBM近二十年算法和數(shù)據(jù)挖掘經(jīng)驗
 
　　He holds Ph.D. in Engineering from the Institute of Computing Technology, Chinese Academy of Sciences
 
　　Bachelor of Mathematics, Wuhan University
 
　　Former Chief Scientist of SAS China
 
　　He has nearly 20 years of experience in data algorithms and data mining in TeraData & IBM.
 
　　隨著汽車產(chǎn)業(yè)新四化的演進，在智能化的下半場，主機廠與其產(chǎn)業(yè)配套供應商已經(jīng)意識到，產(chǎn)品的功能和體驗不僅僅依靠軟件定義來實現(xiàn)，同時更加需要芯片定義的支持，才能在滿足性能和安全性的同時，給用戶提供具有更高性價比的方案與產(chǎn)品。
 
　　With the evolution of the New Four Modernizations of the automobile industry, in the second half of the intelligentization，both original equipment manufacturers (OEMs) and their industry suppliers have recognized that the functionality and user experience of products rely not only on software definition but also on chip definition. This support from chip definition is essential to provide users with solutions and products that offer higher cost-effectiveness while meeting performance and safety requirements.
 
　　在整車架構趨同、功能同質化嚴重的智能汽車時代，重“芯”構建生態(tài)，給車主帶來更加個性化的場景體驗，就需要更智能化的算法和超性價比系統(tǒng)方案。但是今天，一款車型的SOP大概需要36~48個月，芯片的開發(fā)周期也需要24~36個月。9成以上的在售新車型，都在用上一代芯片。讓新車不再用“舊“芯片是芯華章仿真車希望賦能行業(yè)解決的核心問題。
 
　　In the era of smart cars with similar vehicle architectures and function homogeneity, more intelligent algorithms and super cost-effective system solutions are needed to focus on "core" to build an ecology and bring more personalized scene experiences to car owners. But today, the SOP of a car model takes about 36-48 months, and the chip delivery cycle also takes 24-36 months. More than 90% of the new models on sale are using the previous generation of chips. Making new cars no longer use "old" chips is the core problem that X-EPIC car simulation solution aims to solve.
 
　
 
　　2021年6月10日，芯華章正式發(fā)布了《EDA 2.0白皮書》。
 
　　June 10, 2021,  X-EPIC officially released "EDA 2.0 White Paper"
 
　　

 
　　芯華章科技董事長兼CEO王禮賓：
 
　　Mr. Wang Libin, Chairman and CEO of X-EPIC
 
　　智能化的EDA 2.0時代，會使設計芯片像開發(fā)程序那樣簡單，制造芯片像搭積木那樣靈活，這個未來并不遙遠，技術已經(jīng)在路上，芯華章有信心讓EDA 2.0誕生在中國，誕生在離未來最近的地方。
 
　　In the era of intelligent EDA 2.0, designing chips will be as simple as software programing, manufacturing chips are as flexible as building legos, this future is not far away, the technology is already on the way, X-EPIC is confident in bringing about the birth of EDA 2.0 in China, right at the forefront of the future.
 
　　
 
　　深耕汽車電子產(chǎn)業(yè)，芯華章對EDA 2.0踐行和突破。在芯華章的仿真車解決方案中，借助自主研發(fā)的高性能硬件仿真系統(tǒng)HuaEmu E1：
 
　　用戶能夠針對不同的應用場景，來預判車輛在實際使用過程中出現(xiàn)的風險；
 
　　實現(xiàn)軟硬件的開發(fā)解耦和前置，幫助主機廠縮短研發(fā)周期；
 
　　降低學習門檻，豐富開發(fā)工具的同時優(yōu)化硬件設計；
 
　　更快進階到個性化定義EEA系統(tǒng)，縮短產(chǎn)品上市時間，在激烈的市場競爭中贏得先機
 
　　Deeply cultivating in the automotive electronics industry is the practice and breakthrough of X-EPIC's EDA 2.0. In X-EPIC's car simulation solution, with the help of the self-developed high-performance emulation system HuaEmu E1:
 
　　Users can predict the risks of vehicles in actual use for different scenarios.
 
　　Decouple of software and hardware development from early on, help OEMs shrink the R&D cycle.
 
　　Flatten the learning curve, enrich the development tools and optimize the hardware design.
 
　　Advance to the customized definition of the EEA system, shorten the time to market, and take the leading position in new market competition.
 
　　目前，芯華章的仿真車解決方案，已經(jīng)率先在國內頭部主機廠和Tier1方案上中得到突破性嘗試。智己汽車整車研發(fā)中心副總工程師兼架構及整車集成部總監(jiān)康飛表示：
 
　　在車規(guī)芯片的應用、測試過程當中，需要與搭載的軟件提前進行配合，才能夠降低芯片在整車應用過程中的風險，確保低故障的同時，又能夠讓芯片的性能真正的發(fā)揮。
 
　　一款優(yōu)秀的場景和芯片仿真驗證工具，可以幫助解決時間、人才、工具等三方面的挑戰(zhàn)，更快地進行定制化芯片的研發(fā)，降低開發(fā)人才門檻，縮短開發(fā)周期，降低各項風險。
 
　　芯片和應用軟件的協(xié)同開發(fā)是未來汽車領域產(chǎn)品差異化及提升用戶體驗的關鍵點之一，借助強大的仿真、定義、驗證工具，能夠幫助產(chǎn)品實現(xiàn)更好的差異化，從而為用戶提供更高性價比的產(chǎn)品。
 
　　At present, X-EPIC's car simulation solution has taken the lead in making breakthrough attempts in domestic head OEMs and Tier1 solutions. Kang Fei, Deputy Chief Engineer and Director of Architecture and Vehicle Integration Department at Zhiji Automotive Research and Development Center says:
 
　　In the application and testing process of automotive-grade, it is necessary to coordinate with the ded software in advance in order to reduce risks during the chip's integration into the vehicle system. This ensures both low failure rates and the optimal performance of the chip.
 
　　An excellent scenario and chip simulation verification tool can help address challenges in terms of time, talent, and tools. It enables faster development of customized chips, reduces the talent threshold for development, shortens the development cycle, and mitigates various risks.
 
　　The collaborative development of chips and application software is one of the key factors for product differentiation and improving user experience in the future automotive industry. With powerful simulation, definition, and verification tools, products can achieve better differentiation, thus providing us with higher cost-effective solutions.
 
　　芯華章先進的系統(tǒng)級場景仿真平臺和協(xié)同驗證平臺，幫助汽車電子加快下一代電子電氣架構的“芯”迭代，賦能客戶構建“芯”生態(tài)，掌握“芯”動力。
 
　　X-EPIC's advanced system-level scenario simulation platform and collaborative verification platform, help automotive electronics accelerate the "core" iteration of the next-generation electrical and electronic architecture, empowering customers to create an "SoC" ecosystem and harness the full potential of "SoC" technology.